SURLON GROUP / INDUSTRIES / SEMICONDUCTOR

BUILT FOR THE TEST FLOOR. MACHINED FOR THE FAB.

A test socket and a wafer chuck ask for opposite things — an ESD safe polymer held dead-flat in a clean room, and a metal fitting machined to microns. Surlon Group supplies both — Surlon India’s engineering polymers and Surlon Precision Solutions’ aerospace grade machining — from one integrated group.

5

FACTORIES, INDIA

700+

FACTORIES, INDIA

30+

FACTORIES, INDIA

5

FACTORIES, INDIA

94%

FACTORIES, INDIA

ONE SEMICONDUCTOR SUPPLY CHAIN

TWO SURLON GROUP COMPANIES. ONE CHIP, ONE FAB.

A test socket and a wafer chuck ask for opposite things — an ESD-safe polymer machined dead-square in a clean room, and a stainless or brass fitting held to microns. Surlon Group builds both in-house, so semiconductor OEMs and fabs source a full tooling set from one group.

SURLON INDIA

ENGINEERING PLASTICS

ESD-safe PEEK, PAI, POM and cast nylon parts, running in test sockets, vacuum chambers and wetprocess tooling today.

↓ Products & Capability Below

SURLON PRECSION SOLUTIONS

PRECISION MACHINING

EN 9100 aerospace-grade CNC machining of small, tight-tolerance metal parts — steel, alloys, copper, brass — ready for fab hardware.

ESD-SAFE POLYMERS, PROVEN ON THE TEST FLOOR.

MATERIALS FOR BACK-END TEST & FIXTURING

5 grades

The miniaturization of IC devices is pushing back-end test to the limits of polymeric materials — thinner cross sections that still need to hold their shape. Surlon India answers with Polytuff®, Metalon®, MetaPOM® and Metron® ESD-safe grades, machined in a temperature-controlled, clean-room environment up to 5-axis, for test sockets, vacuum chambers and wet-process tooling.

POLYTUFF® (PPH)

  • Purpose-built for semiconductor & electronics
  • Free from porosity, center-line defects & contamination
  • Each plate annealed for lower stress

METALON® (PA-ESD)

  • Cast polyamide modified for harsh environments
  • Meets semiconductor purity requirements
  • Plates & rods in various sizes, easily machined

METAPOM® (POM-ESD)

  • High dimensional stability — ideal for fixtures & test jigs
  • Superior stiffness with very low moisture absorption
  • Easy to machine to precision tolerances

METRON (PEEK-ESD)

  • Higher-temperature, precision-part grade
  • Very low CLTE over a wide temperature range
  • Rigid, moisture & chemical
    resistant

METRON (PAI)

  • Optimized for vacuum chamber applications
  • Low erosion in plasma chambers, low outgassing
  • Excellent low ionic content for demanding chambers

TEST SOCKET TRENDS

Why it matters

As IC devices shrink, cross sections thin out and require stiffer materials to survive test conditions — the challenge is enhancing stiffness while preserving machinability of ever – smaller hole size and pitch.

Higher I/O count

Smaller hole & pitch sizes

Thinner cross sections

CRITICAL PROPERTIES

FLEXURAL MODULUS

Manages the robustness of the finished socket under test conditions.

MELTING POINT

Critical for clean through-holes during drilling.

TENSILE ELONGATION

Controls the accuracy of holes
during machining.

CLTE

Dimensional stability over a
varied temperature range in
use.

MOISTURE ABSORPTION

Critical for maintaining
dimensional stability.

VACUUM CHAMBER SOLUTIONS

KEY CONSIDERATIONS
  • Increasing energy in plasma chambers
  • More aggressive plasma chemistries, oxygen exposure
  • Material selection tuned per application for cost vs. performance
  • Replacing polyimide for reduced cost & higher performance
  • Careful use of ceramics & quartz — cost & breakage risk
  • Higher ionic-purity requirements as node size shrinks
TYPICAL APPLICATIONS
  • Screws & pins
  • Clamp & trench rings
  • Valve housings
  • Shower heads
  • Various etch & CVD parts

WET PROCESS SOLUTIONS

KEY CONSIDERATIONS
  • Corrosion resistance
  • Flatness
  • Strength & wear
  • Purity
  • Chemical resistance
  • Dimensional strength
TYPICAL APPLICATIONS
  • Spin discs & chucks
  • Wafer motion gears
  • Shower heads
  • Wafer grabbers
  • Pins & screws
MINIMAL CENTER-LINE POROSITY

Surlon has developed proprietary processing methods to minimize the high stress and center-line porosity common with standard polypropylene. Plates from 2″ to 5″ thickness are manufactured to the highest standards for the semiconductor wet-process industry — delivering an ultra-clean plate that minimizes surface contaminants at lower overall cost.

IN-HOUSE MACHINING ENVIRONMENT

Why it holds tolerance

Every polymer part is machined on-site, not just moulded — the same environment that stabilizes a cast nylon bearing for a wind turbine also holds a test-socket bore to spec.

Temperature-controlled shop

Clean room manufacturing

5-axis precision machining

In-house polymer testing lab

PARTNER WITH SURLON GROUP

BRING YOUR FAB PROGRAM TO A GROUP
THAT MACHINES AND MOULDS IT ALL.

Whether you need an ESD-safe polymer part running in the fab tomorrow, or a precision-machined metal component built to aerospace tolerance, Surlon Group’s design and engineering teams work from spec to production.